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COOLSPAN™ Materials

Thermal Interface Material

• Two versions - 4 and 5.5 W/m.K - high thermal performance
• Non-silicone polymer
• Bondlines as thin as 2 mils and very low contact resistance for superior thermal impedance
• Very good interaction between binder and filler - minimum oil bleed during use
• Very reliable - will maintain functionality under use conditions
• Can be easily dispensed and available in preforms

Thermally and Electrically Conductive Adhesive

• High thermal conductivity or high electrically conductivity
• Excellent chemical resistance
• High temperature performance
• Custom preforms

Thermal Interface Material Datasheets		Size
	COOLSPAN TIM 300 Datasheet	67 KB
Thermally Electrically Conductive Adhesive Datasheets		Size
	COOLSPAN 500 Fabrication Sheet	117 KB
	COOLSPAN 500 Technical Data	135 KB