LONGLITE™ AND R/flex® Flexible Circuit Materials - Thin Dielectrics

Rogers is the first choice for flexible solutions…
because we understand the dynamics of your industry and offer you the competitive edge.

Rogers Flexible circuit materials for the most technically demanding flexible circuit applications:

hard disk drives
cellular phones
laptop computers
personal digital assistants semiconductor packages
many more

Rogers Superior performance

We are determined to provide our customers with dielectrics that are:

exceptionally reliable
technologically superior
thin, flexible, and robust

Rogers Quality assurance

Manufactured in an ISO-9001:2000 certified facility.
Our highly automated coating and laminating has been continuously upgraded for precise process control, cleanliness and schedule flexibility.

Rogers Sales, technical service, customer service – around the world

Contact our expert sales, technical service and customer service personnel in North and South America, Europe and Asia.

Rogers Flexible Circuit Materials: Product Lines

	LONGLITE™ Flex 200 Adhesiveless Materials Single sided, adhesiveless laminates specifically designed for thinner flex circuit constructions.
	LONGLITE™ Flex 300 Adhesiveless Series Thin dielectric, double-clad, adhesiveless laminates designed to meet today's high performance inteconnection requirements.
	R/flex® 1000 Circuit Materials for Long-life Dynamic Flexing High performance polyimide film-based laminates with rolled annealed copper foil and coversheets ideally suited for constructing single and double sided flexible circuitry.
	R/flex® 1100 Circuit Materials - High Temperature Laminates High performance flexible circuit material system, designed for use in harsh, high temperature environments.
	R/flex® 1500 Assembly Adhesive Unsupported (without backing) dry film adhesive especially designed to meet the demanding requirements of electronics assembly operations.
	R/flex® 2001 Laminates and Coverfilms High performance circuit material system, especially formulated for high peel strength and IPC-FC-241 and 232/1 performance.
	R/flex® 2005 Laminates and Coverfilms Material system consisting of polymide film based laminates with rolled annealed copper foil, cover sheet, bonding film. Delivers: wide process latitude high bond strength solvent resistance improved electrical performance in critical applications due to low moisture absorption and closely controlled adhesive thickness
	R/flex® 8080 Liquid Photoimageable Covercoat Enables ultra-fine patterns needed for today's high-density flexible printed circuits Designed for manufacturing high precision patterns unattainable through conventional screen printing. Provides uniform coverage and reliable performance in mass production processes.
	R/flex CRYSTAL® Laminates and Coverlayers Flame retardant epoxy adhesive technology base on a new film Copper-clad laminates with rolled annealed and electrodeposited copper foils well suited for constructing single and double sided flexible circuitry.
	R/flex JADE® Series Flexible copper-clad laminate material – the next generation of industry-leading R/flex CRYSTAL® epoxy Halogen-free flame retardant flexible material engineered especially to meet increasing environmental requirements without compromising performance in today's demanding flexible circuit designs.